Core piece and non-contact communication type information carrier using the core piece

ABSTRACT

An inexpensive non-contact communication type information carrier with good handling capability and productivity, characterized in that an IC chip  1  formed integral with the antenna coil  3  is mounted in a recessed portion  6  of a core piece body  5  to form a core piece  11  and that the core piece  11  is mounted at a predetermined position on the information carrier.

This application is the national phase under 35 U.S.C. § 371 of PCTInternational Application No. PCT/JP02/02560 which has an Internationalfiling date of Mar. 18, 2002, which designated the United States ofAmerica.

TECHNICAL FIELD

The present invention relates to a non-contact communication typeinformation carrier having a semiconductor IC chip integrally formedwith a non-contact communication type antenna.

BACKGROUND ART

Proposals have been made to attach an IC chip integrally formed with anantenna coil to parts and products for their inventory management. TheIC chip integrally formed with an antenna coil has also been proposed tobe embedded in an identity card for room entry management and commuterpass applications.

However, IC chips integrally formed with an antenna coil are hard andeasily score their coil formation surfaces when IC chips contact eachother. This renders impossible the packing of IC chips in a bag or theuse of a parts feeder, thus leaving no alternative but to depend onexpensive material handling.

Another drawback is that the IC chip formed integral with an antennacoil is very thin (about 0.2–0.6 mm thick) and fragile, and thus easilydevelops cracks and chipping due to stresses in the coil formationsurface (or its back). This makes secondary processing difficult.

Further, although an insert molding using resin is possible, since theIC chip integrally formed with an antenna coil greatly differs inphysical property from a mold resin, a moldability of the IC chip isbad, making it difficult to produce a large number of molded products.This in turn increases cost.

Further, in the case of an insert molding, a thermal expansion ofembedded resin and stresses and strains during use have direct adverseeffects on the IC chip, resulting in the IC chip circuit being broken inthe worse case.

DISCLOSURE OF THE INVENTION

An object of the present invention is to eliminate these drawbacks ofthe conventional techniques and to provide an inexpensive non-contactcommunication type information carrier with good handling capability andproductivity and a core piece used in the information carrier.

To achieve the above objective, a first means of the present inventioncomprises: an IC chip formed integral with an antenna coil on onesurface thereof; and a core piece body having a recessed portion inwhich the IC chip is inserted and held.

A second means of the invention according to the first means ischaracterized in that a part of a circumferential portion of the ICchip, such as corner portions, is locked by a caulking portion formed atan open end of the recessed portion of the core piece body.

A third means of the invention according to the second means ischaracterized in that a caulking edge forming the caulking portion isprovided with notches, such as V- or U-shaped notches.

A fourth means of the invention according to the second means ischaracterized in that a caulking edge forming the caulking portion ispartly provided with thin portions.

A fifth means of the invention according to the first means ischaracterized in that the IC chip is installed in the recessed portionso that the antenna coil faces a bottom of the core piece body.

A sixth means of the invention according to the first means ischaracterized in that the core piece body is formed of a transparentmaterial such as polycarbonate resin.

A seventh means of the invention comprises: an IC chip formed integralwith an antenna coil on one surface thereof; and a core piece bodyhaving a recessed portion in which the IC chip is mounted to form a corepiece; wherein the core piece is mounted at a predetermined position onthe information carrier.

A eighth means of the invention according to the seventh means ischaracterized in that the IC chip is installed in the recessed portionso that the antenna coil faces a bottom of the core piece body, that thecore piece is mounted in the information carrier so that the bottom ofthe core piece body is on the front surface side of the informationcarrier, and that a surface of the bottom of the core piece body doesnot protrude from a surface of the information carrier.

A ninth means of the invention according to the seventh means ischaracterized in that the IC chip is square and the antenna coil isformed on the IC chip so that a center of the antenna coil almost alignswith a center of the IC chip, that the core piece body is formed with acircular recessed portion at a center position thereof whose diameter isalmost equal to a diagonal length of the IC chip, that the IC chip ismounted in the recessed portion to form the core piece, and that thecore piece is mounted in the information carrier.

A tenth means of the invention according to the ninth means ischaracterized in that the non-contact communication type informationcarrier is shaped like a disc, and that the disc-shaped informationcarrier is formed with a circular engagement recess at a centralposition thereof, in which the core piece is mounted.

A eleventh means of the invention according to the seventh means ischaracterized in that the core piece and the non-contact communicationtype information carrier are formed of plastics, and that a material ofthe core piece is harder than that of the non-contact communication typeinformation carrier.

A twelfth means of the invention according to the seventh means ischaracterized in that the non-contact communication type informationcarrier is a case to accommodate a variety of objects to be inspected,such as DNA chips, test tubes and samples.

These and other objects, features and advantages of the presentinvention will become apparent from the following descriptions ofembodiments thereof taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing a core piece for a non-contactcommunication type information carrier according to a first embodimentof the present invention.

FIG. 2 is a cross-sectional view taken along the line A—A of FIG. 1.

FIG. 3 is an enlarged perspective view of an IC chip formed integralwith an antenna coil for use in the core piece.

FIG. 4 is an enlarged plan view of the IC chip.

FIG. 5 is a plan view showing a process of mounting the IC chip on acore piece body.

FIG. 6 is a cross-sectional view showing the process of mounting the ICchip on the core piece body.

FIG. 7 is a cross-sectional view showing a variation of the core piecefor the non-contact communication type information carrier.

FIG. 8 is a plan view showing a state before the core piece is mountedto a token.

FIG. 9 is a plan view showing a state after the core piece has beenmounted to the token.

FIG. 10 is an enlarged cross-sectional view taken along the line B—B ofFIG. 9.

FIG. 11 is a plan view showing an IC chip for a non-contactcommunication type information carrier according to a second embodimentof the present invention.

FIG. 12 is an enlarged view of a portion C in FIG. 11.

FIG. 13 is a plan view showing a core piece body for use in thenon-contact communication type information carrier.

FIG. 14 is a front view of the partly cutaway core piece body.

FIG. 15 is a plan view of the core piece.

FIG. 16 is a front view of the partly cutaway core piece.

FIG. 17 is a block diagram showing a data transmission system betweenthe non-contact communication type information carrier, a reader/writerand a host computer.

FIG. 18 is a perspective view showing a correspondence between theantenna coil on the information carrier and an antenna coil on thereader/writer.

FIG. 19 is a cross-sectional view of a case (non-contact communicationtype information carrier) according to a third embodiment of the presentinvention.

FIG. 20 is a plan view of a card (non-contact communication typeinformation carrier) according to a fourth embodiment of the presentinvention.

FIG. 21 is a plan view of a card (non-contact communication typeinformation carrier) according to a fifth embodiment of the presentinvention.

FIG. 22 is a plan view of a card (non-contact communication typeinformation carrier) according to a sixth embodiment of the presentinvention.

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiments of the present invention will be described by referring tothe accompanying drawings. FIG. 1 is a plan view of a core piece for anon-contact communication type information carrier according to thefirst embodiment. FIG. 2 is a cross-sectional view taken along the lineA—A of FIG. 1. FIG. 3 is an enlarged perspective view of an IC chip usedin the core piece. FIG. 4 is an enlarged plan view of the IC chip. FIG.5 and FIG. 6 are a plan view and a cross-sectional view illustrating aprocess of mounting the IC chip on the core piece body.

As shown in FIG. 3 and FIG. 4, a square IC chip 1 is integrally formedwith a rectangular, spiral antenna coil 3 on its circuit formation sidethrough an insulating layer 2 of, for example, polyimide resin. Theantenna coil 3 can be formed by an electrocast plating method and aphotoresist method and is connected at its ends to input/outputterminals 4, 4 of the IC chip 1 via through-holes formed in theinsulating layer 2. The IC chip 1 integrally formed with this antennacoil 3 measures about 2–4 mm along its one side and about 0.2–0.6 mmthick.

This IC chip 1, as shown in FIG. 1 and FIG. 2, is mounted on a corepiece body 5. The core piece body 5 is formed of an engineering plasticsuch as thermoplastic synthetic resin and, as shown in FIG. 5 and FIG.6, has a circular recessed portion 6 at the center, which is integrallyformed with a projecting caulking portion 7 along its opencircumference. As shown in FIG. 5, an inner diameter D of the recessedportion 6 is set almost equal to a diagonal length L of the IC chip 1 sothat inserting the IC chip 1 into the recessed portion 6 causes a centerof the IC chip 1 to align with a center of the core piece body 5, i.e.,positions the IC chip 1 inside the core piece body 5.

As shown in FIG. 6, the IC chip 1 is inserted, antenna coil 3 side down,into the recessed portion 6. An ultrasonic fusing horn 8 is pressedagainst the core piece body 5 from above to heat and soften and caulkthe caulking portion 7 inwardly to form a caulked portion 9 that engagesfour corner portions 1 a–1 d of the IC chip 1, as shown in FIG. 1 andFIG. 2. The IC chip 1 is now firmly held in the recessed portion 6(swaging method).

While in this example the IC chip 1 is inserted, antenna coil 3 sidedown, into the recessed portion 6 to protect the antenna coil 3 with abottom portion 12, it is also possible to insert the IC chip 1 into therecessed portion 6, with the antenna coil 3 side up. Since the surfaceof the antenna coil 3 is recessed inwardly from the upper surface of thecore piece body 5 by a distance equal to the thickness of the caulkedportion 9, the antenna coil 3 is protected against being scored when theIC chips 1 are supplied in a bag or by a parts feeder. If the core piecebody 5 is formed of a transparent synthetic resin, it can convenientlybe checked whether or not the IC chip 1 is mounted.

FIG. 7 shows another example of mounting the IC chip 1. In this example,the IC chip 1 is inserted and secured to the recessed portion 6 throughan adhesive 10. In this case, too, the IC chip 1 is inserted, antennacoil 3 side down, into the recessed portion 6.

Mounting the IC chip 1 in the recessed portion 6 of the core piece body5 can protect the antenna coil 3 and also make it large enough tofacilitate handling, so that the assembly as a core piece 11 can bemass-produced and attached to any members where the IC chips 1 are to befitted. This construction in particular can protect with the core piecethe corner portions 1 a–1 d of the IC chip that are easily chipped awayby stresses that occur during handling of the IC chip 1 or after thechip is fitted to a target product.

FIG. 8 to FIG. 10 illustrate an example process of mounting the corepiece 11 to a token 13 used in electronic money transactions, with FIG.8 representing a plan view of a state before the core piece 11 ismounted, FIG. 9 representing a plan view of a state after the core piece11 is mounted, and FIG. 10 representing an enlarged cross-sectional viewtaken along the line B—B of FIG. 9. As shown in FIG. 8, the token 13,circular in plan view and molded of a synthetic resin, has an engagementrecess 14 of the same shape as the core piece 11 at the center. The ICchip 1 is fitted in the engagement recess 14 and fixed there.

At this time, as shown in FIG. 10, the core piece body 5 is set to haveits bottom portion 12 face the front side so that the antenna coil 3comes as close to the front surface of the token 13 as possible but thesurface of the bottom portion 12 does not protrude from the token frontsurface. With the core piece 11 mounted in the IC chip 13 in thismanner, the IC chip 1 storing various information necessary forelectronic money transaction, such as pass word and transaction history,can be used.

The core piece 11 and the token 13 may be coupled together with anadhesive or by providing engagement portions (coupling portions) to thecore piece body 5 and the token 13.

The core piece 11 is preferably formed of engineering plastics such aspolycarbonate or, for applications requiring heat resistance,super-engineering plastics such as PPS (polysulfane) and PEI(polyetherimide). The token 13 is preferably formed of ABS.

As to the materials of the core piece 11 and the information carriersuch as token 13 in which the core piece 11 is mounted, a materialharder than the body such as token 13 is chosen for the core piece 11,considering a stiffness and stress alleviation.

If the core piece 11 is made of a material of the same kind as theinformation carrier or of a softer material, when the core piece 11 isinserted into the recessed portion of the information carrier such astoken 13 or when a stress develops in use, the core piece 11 issubjected to the stress, resulting in the IC chip corners 1 a–1 d beingcracked. However, by selecting for the core piece 11 a material harderthan that of the information carrier, as in this embodiment, the stressacting on the IC chip can be alleviated, preventing a possible chippingor circuit break of the IC chip.

The hardness described above is an impression hardness, such asRockwell, Durometer and Barcol hardness. Particularly the Durometerhardness is preferred whose test procedure is specified in JIS StandardK7215 and which determines a hardness from a depth of an impressed dentformed when a specimen is loaded in a test.

FIG. 11 to FIG. 16 illustrate a second embodiment of the presentinvention. FIG. 11 represents a plan view of an IC chip, FIG. 12 anenlarged view of a portion C in FIG. 11, FIG. 13 a plan view of a corepiece body, FIG. 14 a partly cutaway front view of the core piece body,FIG. 15 a plan view of a core piece, and FIG. 16 a partly cutaway frontview of the core piece.

Depending on its capacity or version, the size of the IC chip 1 maybecome small. On the other hand, the core piece body 5 may not be ableto be reduced in size because of the size of the information carrier onwhich the core piece body 5 is mounted. This embodiment is suitable forsuch a case.

The IC chip 1 used in this embodiment is square, measuring 2.3 mm oneach side, and is formed integral with a spiral antenna coil 3 on acircuit formation surface through an insulating layer (not shown) of,for instance, polyimide resin. The antenna coil 3 is formed rectangular,spiraling along the outline of the IC chip 1 and, in this embodiment,measures about 14 μm in coil width and has a coil-to-coil interval ofabout 4 μm and a total of about 47 turns. The ends of the antenna coil 3are connected to input/output terminals 4, 4 via through-holes formed inthe insulating layer. As shown in FIG. 11, the antenna coil 3 is formedon the IC chip 1 in such a manner that the center O1 of the IC chip 1aligns with the center O2 of the rectangular, spiral antenna coil 3.

The core piece body 5 is shaped like a disc and formed of thermoplasticresin, such as polycarbonate resin and epoxy resin. As shown in FIG. 13and FIG. 14, the core piece body 5 has a circular recessed portion 6 atthe center, which is integrally formed with a projecting caulkingportion 7 along its open circumference. The caulking portion 7 has oneor more V- or U-shaped notches 21 along its circumference.

A diameter D of the recessed portion 6 shown in FIG. 13 is set almostequal to a diagonal length L of the IC chip 1 shown in FIG. 11 so thatinserting the IC chip 1 into the recessed portion 6 causes the center O2of the antenna coil 3 to align with the center O3 of the core piece body5, i.e., positions the antenna coil 3 (IC chip 1) inside the core piecebody 5.

As shown in FIG. 16, the IC chip 1 is inserted, antenna coil 3 sidedown, into the recessed portion 6. An ultrasonic fusing horn is pressedagainst the core piece body 5 from above to heat and soften and caulkthe caulking portion 7 inwardly to form a caulked portion 9 that engagesfour corner portions 1 a–1 d of the IC chip 1, as shown in FIG. 15 andFIG. 16. The IC chip 1 is now firmly held in the recessed portion 6.

As described above, the provision of the notches 21 ensures that thecaulking portion 7 when heated, softened and caulked inwardly does notproduce any corrugations, thus forming the caulked portion 9 extendinginwardly as shown in FIG. 16. As a result, even a small-size IC chip 1can be firmly secured inside the core piece body 5. Further, installingthe IC chip 1, antenna coil 3 side down, into the recessed portion 6 canprotect the antenna coil 3 with the bottom portion 12 of the recessedportion 6.

As shown in FIG. 14 and FIG. 16, the core piece body 5 is formed withone or more annular ribs 22 along its outer circumference. When the corepiece body 5 (core piece 11) is pushed under pressure into theengagement recess 14 of the token 13, as shown in FIG. 8, the core piecebody 5 is firmly engaged in the engagement recess 14 because of thepresence of the annular ribs 22, increasing the coupling strengthbetween the core piece body 5 and the token 13. While in this embodimentthe continuous annular ribs 22 are formed along the circumference, thesimilar effects can also be produced by forming the ribs intermittentlyalong the circumference.

The core piece 11 having the IC chip 1 engaged in the core piece body 5is pushed under pressure into the engagement recess 14 of thedisc-shaped token 13 to form a non-contact communication typeinformation carrier of this embodiment. Since the token 13 has theengagement recess 14 at the center, the center O4 of the token 13 andthe center O2 of the IC chip 1 are made to align with each other, thoughthe direction of the IC chip 1 is arbitrary (see FIG. 8 and FIG. 9).

FIG. 17 is a block diagram showing a data transmission system between anon-contact communication type information carrier 31, a reader/writer32 and a host computer 44 according to the present invention. Theinformation carrier 31 comprises an antenna coil 3, a power generationcircuit 33, a memory 34 and a control circuit 35. The reader/writer 32has an antenna coil 36 corresponding to the antenna coil 3 on theinformation carrier 31 side, a transceiver 37, and a controller 38.These components are related to each other as shown in the figure.

FIG. 18 illustrates a relation between the antenna coil 3 of theinformation carrier 31 and the antenna coil 36 of the reader/writer 32.The antenna coil 36 is wound around a circumference of a columnarferrite core 39 which has a bottom surface of the same size as theexternal size of the antenna coil 3. The ferrite core 39 is so arrangedthat its axis is perpendicular to the plane of the antenna coil 3 andthat its bottom surface is close to the antenna coil 3.

The token 13 mounted on the reader/writer 32 is positioned by a guidemeans (not shown) so that the center of the token 13 (the center of theantenna coil 3) aligns with the center of the bottom surface of theferrite core 39. Therefore, the antenna coil 3 and the antenna coil 36are electromagnetically coupled together for data transmission, nomatter in which direction the token 13 (antenna coil 3) is placed in itsown plane.

FIG. 19 shows a third embodiment of the present invention. On the innerside of a case 42 accommodating a variety of objects 41 to be tested,such as DNA chip, test tube and specimen, a circular engagement recess14 is formed. The core piece 11 is fitted in the engagement recess 14 sothat the antenna coil 3 (not shown) faces toward the outside of the case42. The memory of the core piece 11 stores a variety of data about theobject 41 to be inspected and the data is transmitted between theantenna coil 3 of the core piece 11 and the antenna coil 36 of thereader/writer. In this embodiment, therefore, the case 42 itself servesas a non-contact communication type information carrier.

FIG. 20 represents a fourth embodiment of this invention. In thisembodiment the core piece 11 is embedded in a card 43, which consists oftwo card halves of the same shape bonded together with the core piece 11in between. The core piece 11 is situated at a position which isintermediate between two opposing longer sides 43 a, 43 b of the card 43and which is also shifted from a center in a card insertion direction Xtoward the reader/writer.

FIG. 21 illustrates a fifth embodiment of this invention. A point inwhich this embodiment differs from the fourth embodiment is that thecore piece 11 is situated at a position which is intermediate betweentwo opposing shorter sides 43 c, 43 d of the card 43 and which is alsoshifted from a center in a card insertion direction X toward thereader/writer.

FIG. 22 illustrates a sixth embodiment of this invention. A point inwhich this embodiment differs from the fourth embodiment is that thecore piece 11 is situated at the center of the card 43.

The embedding of the core piece 11 in the card 43 may be accomplished,rather than by bonding two card halves together, but by integrallymolding the card with a core piece engagement recess and then fittingthe core piece into the engagement recess.

While in this embodiment the core piece body is formed with a caulkingportion by which the IC chip is held in the recessed portion, it is alsopossible to simply fit the IC chip in the recessed portion and hold itthere, rather than forming the caulking portion.

The application of the non-contact communication type informationcarrier according to the present invention is not limited to tokens,cards, and cases accommodating a variety of objects to be inspected,such as DNA chips, test tubes and specimens, but it can also be appliedto a wide range of industrial fields.

For example, it can be applied to very small areas where itsapplications have so far been considered impossible, such as connectors,frames and cases of electronic cards compatible with PC card standardand compact flash standard, front ends of pen type pointing devices,connectors of LAN cables and optical cables, automotive keys, cases ofoptical discs, magnetic discs and tape media, and media themselves.

INDUSTRIAL APPLICABILITY

With the invention according to claim 1, since the IC chip formedintegral with the antenna coil is inserted and held in the recessedportion of the core piece body, the coil formation surface can beprotected and the IC chip can be made large enough to facilitatehandling. This in turn allows the IC chips to be packed in bags andsupplied by a parts feeder. It is therefore possible to provide alow-cost core piece for a non-contact communication type informationcarrier with good handling capability and productivity.

With the invention according to claim 2, since a part of acircumferential portion of the IC chip is locked by a caulking portionformed at an open end of the recessed portion of the core piece body,the IC chip is protected against being stressed excessively, preventingpossible cracking or chipping.

With the invention according to claim 3, since a caulking edge formingthe caulking portion is provided with notches, the caulking portion freeof corrugations can be formed, reliably securing the IC chip to therecessed portion of the core piece body even if the IC chip is reducedin size.

With the invention according to claim 4, since a caulking edge formingthe caulking portion is provided with thin portions, the caulkingportion with no corrugations can be formed, reliably securing the ICchip to the recessed portion of the core piece body even if the IC chipis reduced in size.

With the invention according to claim 5, since the IC chip is installedin the recessed portion so that the antenna coil faces a bottom of thecore piece body, the coil formation surface can be reliably protected.

With the invention according to claim 6, since the core piece body isformed of a transparent material, a mounting state of the IC chip can bechecked conveniently from outside.

With the invention according to claim 7, since the IC chip formedintegral with an antenna coil is mounted in a recessed portion of thecore piece body, the coil formation surface can be protected and the ICchip can be made large enough to facilitate handling. This in turnallows the IC chips to be packed in bags and supplied by a parts feeder.It is therefore possible to provide a low-cost non-contact communicationtype information carrier with good handling capability and productivity.

Further, where information carriers are of differing kinds, shapes andspecifications, it is possible to use the same core pieces commonly forthese information carriers by forming their core piece mounting portionsto the same shape.

With the invention according to claim 8, since the IC chip is installedin the recessed portion so that the antenna coil faces a bottom of thecore piece body, since the core piece is mounted in the informationcarrier so that the bottom of the core piece body is on the frontsurface side of the information carrier, and since a surface of thebottom of the core piece body does not protrude from a surface of theinformation carrier, the coil formation surface can be protected and theinformation carrier can be smoothly handled without the core piece beingcaught by other objects (e.g., during insertion and removal of theinformation carrier to and from the reader/writer).

With the invention according to claim 9, since the IC chip is square andthe antenna coil is formed on the IC chip so that a center of theantenna coil almost aligns with a center of the IC chip, since the corepiece body is formed with a circular recessed portion at a centerposition thereof whose diameter is almost equal to a diagonal length ofthe IC chip, since the IC chip is mounted in the recessed portion toform the core piece, and since the core piece is mounted in theinformation carrier, there is no need to take into account a directionof the small IC chip when mounting it on the core piece body, thusfacilitating the IC chip mounting process and enhancing theproductivity.

With the invention according to claim 10, since the non-contactcommunication type information carrier is shaped like a disc and sincethe disc-shaped information carrier is formed with a circular engagementrecess at a central position thereof, in which the core piece ismounted, there is no need to take into account a direction in which theinformation carrier is inserted into the reader/writer, making thenon-contact communication type information carrier easy to handle andlowering its cost.

With the invention according to claim 11, since the core piece and thenon-contact communication type information carrier are formed ofplastics and since a material of the core piece is harder than that ofthe non-contact communication type information carrier, when the corepiece 11 is fitted into the recessed portion of the information carrieror when a stress develops during the use of the information carrier, thestress acting on the IC chip can be alleviated, preventing a possiblecracking or circuit break of the IC chip.

With the invention according to claim 12, since the non-contactcommunication type information carrier is a case to accommodate avariety of objects to be inspected, such as DNA chips, test tubes andsamples, it is possible to provide at low cost a case that can reliablyposition these objects for non-contact communication and allows formanagement of the objects being inspected.

The above descriptions have been made of example embodiments and it isapparent to a person skilled in the art that various changes andmodifications may be made within the spirit and the scope of claims ofthe present invention.

1. A core piece for a non-contact communication information carrier,comprising: an IC chip having an insulating layer formed over a circuitformation surface thereof, through-holes formed in the insulating layerand an antenna coil formed on the insulating layer and electricallyconnected via the through-holes to a circuit formed on the circuitformation surface, whereby the antenna coil is formed integrally so thatthe entire coil is formed on the surface of the IC chip; and a corepiece body having a recessed portion and a caulking portion formed at anopen end of the recessed portion; wherein the IC chip is inserted intothe recessed portion of the core piece body and a part of acircumferential portion of the IC chip is locked by the caulking portionalong only a circumferential portion of the IC chip.
 2. A core piece fora non-contact communication information carrier according to claim 1,wherein a caulking edge forming the caulking portion is provided withnotches.
 3. A core piece for a non-contact communication informationcarrier according to claim 1, wherein a caulking edge forming thecaulking portion is partly provided with thin portions.
 4. A core piecefor a non-contact communication information carrier according to claim1, wherein the IC chip is installed in the recessed portion so that theantenna coil faces a bottom of the core piece body.
 5. A core piece fora non-contact communication information carrier according to claim 1,wherein the core piece body is formed of a transparent material.
 6. Anon-contact communication information carrier, comprising: an IC chiphaving an insulating layer formed over a circuit formation surfacethereof, through-holes formed in the insulating layer and an antennacoil formed on the insulating layer and electrically connected via thethrough-holes to a circuit formed on the circuit formation surface; anda core piece body having a recessed portion; wherein the IC chip ismounted in the recessed portion of the core piece body to form a corepiece and the core piece is mounted at a predetermined position on theinformation carrier, whereby the surface of said antenna coil isrecessed inwardly from the upper surface of the core piece body.
 7. Anon-contact communication information carrier according to claim 6,wherein the IC chip is installed in the recessed portion so that theantenna coil faces a bottom of the core piece body, wherein the corepiece is mounted in the information carrier so that the bottom of thecore piece body is on the front surface side of the information carrier,wherein a surface of the bottom of the core piece body does not protrudefrom a surface of the information carrier.
 8. A non-contactcommunication information carrier according to claim 6, wherein the ICchip is square and the antenna coil is formed integral with the IC chipso that a center of the antenna coil almost aligns with a center of theIC chip, wherein the core piece body is formed with a circular recessedportion at a center position thereof whose diameter is almost equal to adiagonal length of the IC chip, wherein the IC chip is mounted in therecessed portion to form the core piece, wherein the core piece ismounted in the information carrier.
 9. A non-contact communicationinformation carrier according to claim 8, wherein the non-contactcommunication information carrier is disc-shaped, wherein thedisc-shaped information carrier is formed with a circular engagementrecess at a central position thereof, in which the core piece ismounted.
 10. A non-contact communication information carrier accordingto claim 6, wherein the core piece and the non-contact communicationinformation carrier are formed of plastics, wherein a material of thecore piece is harder than that of the non-contact communicationinformation carrier.
 11. A non-contact communication information carrieraccording to claim 6, wherein the non-contact communication informationcarrier is a case to accommodate an object to be inspected.